参数资料
型号: MBR120ESFT1G
厂商: ON Semiconductor
文件页数: 2/5页
文件大小: 105K
描述: DIODE SCHOTTKY 20V 1A SOD123FL
产品目录绘图: SOD-123FL, SOD-123 Pkg
标准包装: 1
二极管类型: 肖特基
电压 - (Vr)(最大): 20V
电流 - 平均整流 (Io): 1A
电压 - 在 If 时为正向 (Vf)(最大): 530mV @ 1A
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 10µA @ 20V
安装类型: 表面贴装
封装/外壳: SOD-123F
供应商设备封装: SOD-123L
包装: 标准包装
产品目录页面: 1568 (CN2011-ZH PDF)
其它名称: MBR120ESFT1GOSDKR
MBR120ESF, NRVB120ESF
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
RRM
RWM
VR
20
V
Average Rectified Forward Current
(At Rated VR, TL
= 140
°C)
IO
1.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TL
= 125
°C)
IFRM
2.0
A
Non?Repetitive Peak Surge Current
(Non?Repetitive peak surge current, halfwave, single phase, 60 Hz)
IFSM
40
A
Storage Temperature
Tstg
?65 to 150
°C
Operating Junction Temperature
TJ
?65 to 150
°C
Voltage Rate of Change (Rated VR, TJ
= 25
°C)
dv/dt
10,000
V/s
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t
he
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance ?
Junction
?to?Lead (Note 1)
Thermal Resistance ?
Junction
?to?Lead (Note 2)
Thermal Resistance ?
Junction
?to?Ambient (Note 1)
Thermal Resistance ?
Junction
?to?Ambient (Note 2)
R
R
tjl
R
tjl
R
tja
tja
26
21
325
82
°C/W
1. Mounted with minimum recommended pad size, PC Board FR4.2
).
2. Mounted with 1 in. copper pad (Cu area 700 mm
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage (Note 3), See Figure 2
VF
TJ
= 25
°C
TJ
= 100
°C
V
(IF
= 0.1 A)
(IF
= 1.0 A)
(IF
= 2.0 A)
0.455
0.530
0.595
0.360
0.455
0.540
Maximum Instantaneous Reverse Current (Note 3), See Figure 4
IR
TJ
= 25
°C
TJ
= 100
°C
A
(VR
= 20 V)
(VR
= 10 V)
(VR
= 5.0 V)
10
1.0
0.5
1600
500
300
3. Pulse Test: Pulse Width ≤
250
s, Duty Cycle ≤
2%.
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